• Advances in Thermal Modeling of Electronic Components and Systems: Volume 2

Advances in Thermal Modeling of Electronic Components and Systems: Volume 2

ASME International , 01/01/1990

Publisher: ASME

File Format: PDF

$54.00$109.00


The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

More ASME Standards PDF

ASME B18.2.5M-2013

ASME B18.2.5M-2013

$16.00 $33.00

ASME B5.57-2012 (R2022)

ASME B5.57-2012 (R2022)

$55.00 $110.00

ASME PTB-7-2014

ASME PTB-7-2014

$136.00 $272.00

ASME B30.21-2014 (R2019)

ASME B30.21-2014 (R2019)

$30.00 $60.00