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ASTM International , 11/01/2012
Publisher: ASTM
File Format: PDF
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1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
1.2 The procedures appear in the following sections:
Procedure
Section
Referenced Documents
2
Conditioning
4
Dielectric Breakdown Voltage Parallel to Laminations
13
Dimensional Instability
19
Dissipation Factor
14
Flammability Rating Test
16
Flexural Strength, Flatwise at Elevated Temperature
15
Flexural Strength, Flatwise at Room Temperature
Oven Blister Test
17
Peel Strength Test at Elevated Temperature
10
Peel Strength Test at Room Temperature
9
Permittivity
Pin Holes in Copper Surface
20
Purity of Copper
5
Scratches in Copper Surface
21
Solder Float Test
8
Solvent Resistance
7
Surface Resistivity
11
Volume Resistivity
Terminology
3
Thickness & Thickness Variation
18
Warp or Twist
6
Water Absorption
12
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
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