• ASTM F3147-15

ASTM F3147-15

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)

ASTM International , 06/01/2015

Publisher: ASTM

File Format: PDF

$33.00$66.00


1.1This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

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