BS 3934-5:1997

Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

BSI Group , 09/15/1997

Publisher: BS

File Format: PDF

$154.00$309.88

Description

Standard By:BSI Group , 09/15/1997

Published:09/15/1997

Pages:38

ISBN(s):0580278123

File Size:1 file , 940 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

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