BS 5909:1980

Method for scale adhesion test for oxygen-free copper

BSI Group , 04/30/1980

Publisher: BS

File Format: PDF

$80.00$160.02

Description

Standard By:BSI Group , 04/30/1980

Published:04/30/1980

Pages:2

ISBN(s):0580112659

File Size:1 file , 290 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

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