BS PD IEC/TS 62647-4:2018

BS PD IEC/TS 62647-4:2018, which is a Technical Specification, defines the requirements forreplacing solder balls on ball grid array (BGA) component packages in the context of anelectronic components management plan (ECMP) for aerospace, defence and high reliabilityproducts.Cross References:IEC 62668IEC TR 61340-5-2JEDEC JESD625IPC J-STD-004IPC-TM-650 number 2.3.25ECA/IPC/JEDEC J-STD-075JEDEC JESD22-B117IPC J-STD-005IPC/JEDEC J-STD-020IPC/JEDEC J-STD-033JEDEC JESD22-B107AEC-Q100-010ANSI/ESD S20.20IEC 62090IPC J-STD-002JEDEC JESD22-B101IPC J-STD-001xSIPC J-STD-001MIL-STD-883IPC/JEDEC J-STD-035SAE AS5553JEDEC JESD213JEDEC JESD22-A101IEC 61340-5-1JEDEC J-STD-046IEC TS 62647-21:2013 IEC TS 62668-1:2016IEC TS 62647-2:2012IEC TS 62647-22:2013IEC TS 62647-3:2014EIA-STD-4899ISO/IEC 17050-1MIL-PRF-38535IEC TS 62647-23IEC 62647IPC-7711/7721IDEA-STD-1010JEDEC JESD22-B112MIL-PRF-19500JEDEC JESD22-A104AS/EN/JISQ 9100MIL-PRF-38534IEC TS 62239-1IPC-TM-650 number 2.3.28IEC TS 62668-2 IEC TS 62647-1JESD22-B108