• IEC 60068-2-54 Ed. 2.0 b:2006

IEC 60068-2-54 Ed. 2.0 b:2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

International Electrotechnical Commission , 04/27/2006

Publisher: IEC

File Format: PDF

$58.00$117.00


IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

IEC 60068-2-54 Ed. 2.0 b:2006 History

IEC 60068-2-69 Ed. 3.1 b:2019
IEC 60068-2-69 Ed. 3.0 b:2017
IEC 60068-2-69 Ed. 2.0 en:2007
IEC 60068-2-54 Ed. 2.0 en:2006
IEC 60068-2-54 Ed. 2.0 b:2006
IEC 60068-2-69 Ed. 1.0 b:1995

More IEC Standards PDF

IEC 62783-1-1 Ed. 1.0 en:2022
ICC IRC-2021 Vol. 1 Commentary
IEC 63207 Ed. 1.0 b:2022

IEC 63207 Ed. 1.0 b:2022

$47.00 $95.00

IEC 61869-99 Ed. 1.0 b:2022

IEC 61869-99 Ed. 1.0 b:2022

$183.00 $367.00