IEC 60068-2-54 Ed. 2.0 en:2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

International Electrotechnical Commission , 04/27/2006

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 04/27/2006

Published:04/27/2006

Pages:18

File Size:1 file , 350 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.