IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

International Electrotechnical Commission , 04/23/1997

Publisher: IEC

File Format: PDF

$139.00$278.00

Description

Standard By:International Electrotechnical Commission , 04/23/1997

Published:04/23/1997

Pages:71

File Size:1 file , 570 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

More IEC Standards PDF

IEC 61112 Ed. 1.1 b:2002

$89.00 $179.00

IEC 60335-1 Ed. 4.0 b CORR1:2002

$94.00 $188.43

IEC 61229 Ed. 1.2 b:2002

$202.00 $405.00

IEC 60404-14 Ed. 1.0 b:2002

$47.00 $95.00