IEC 60191-6-13 Ed. 1.0 b:2007

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

International Electrotechnical Commission , 06/27/2007

Publisher: IEC

File Format: PDF

$36.00$73.00


IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

IEC 60191-6-13 Ed. 1.0 b:2007 History

IEC 60191-6-13 Ed. 2.0 b:2016
IEC 60191-6-13 Ed. 1.0 b:2007
IEC 60191-6-13 Ed. 1.0 en:2007

More IEC Standards PDF

IEC 61280-2-4 Ed. 1.0 b:1998
IEC 60684-3-217 Ed. 1.0 b:1998
IEC 61290-2-1 Ed. 1.0 b:1998
IEC 61161 Ed. 1.1 b:1998

IEC 61161 Ed. 1.1 b:1998

$46.00 $92.00