IEC 60191-6-13 Ed. 1.0 b:2007

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

International Electrotechnical Commission , 06/27/2007

Publisher: IEC

File Format: PDF

$36.00$73.00


IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

IEC 60191-6-13 Ed. 1.0 b:2007 History

IEC 60191-6-13 Ed. 2.0 b:2016
IEC 60191-6-13 Ed. 1.0 b:2007
IEC 60191-6-13 Ed. 1.0 en:2007

More IEC Standards PDF

IEC 62328-1 Ed. 1.0 en:2005
IEC 60335-2-79 Ed. 2.1 en:2005
IEC 60974-1 Ed. 3.0 b:2005

IEC 60974-1 Ed. 3.0 b:2005

$155.00 $310.00

IEC 60335-2-4 Ed. 5.1 b:2005