IEC 60191-6-17 Ed. 1.0 b:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

International Electrotechnical Commission , 01/27/2011

Publisher: IEC

File Format: PDF

$117.00$234.00

Standard By:International Electrotechnical Commission , 01/27/2011

Published:01/27/2011

Pages:53

File Size:1 file , 640 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

$72.00 $145.00

$177.00 $354.00

$72.00 $145.00

$177.00 $354.00