• IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission , 05/31/2010

Publisher: IEC

File Format: PDF

$91.00$182.47


More IEC Standards PDF

IEC 62087-5 Ed. 1.0 en:2015
IEC 61755-2-4 Ed. 1.0 en:2015
IEC 60794-3-21 Ed. 2.0 b:2015
IEC 62087-6 Ed. 1.0 en:2015