IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission , 07/28/2010

Publisher: IEC

File Format: PDF

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Standard By:International Electrotechnical Commission , 07/28/2010

Published:07/28/2010

Pages:1

File Size:1 file , 81 KB

Language:English, French

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