IEC 60191-6-2 Ed. 1.0 en COR. 1:2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission , 10/18/2002

Publisher: IEC

File Format: PDF

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Standard By:International Electrotechnical Commission , 10/18/2002

Published:10/18/2002

Pages:1

File Size:1 file , 130 KB

Language:English

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