• IEC 60191-6-20 Ed. 1.0 b:2010

IEC 60191-6-20 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

International Electrotechnical Commission , 08/30/2010

Publisher: IEC

File Format: PDF

$25.00$51.00


IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

More IEC Standards PDF

IEC 60601-2-31 Ed. 2.1 b:2011
IEC 60065 Ed. 7.2 b:2011

IEC 60065 Ed. 7.2 b:2011

$363.00 $726.00

IEEE 1581-2011

IEEE 1581-2011

$54.00 $109.00

IEC 61821 Ed. 2.0 b:2011

IEC 61821 Ed. 2.0 b:2011

$117.00 $234.00