IEC 60191-6-4 Ed. 1.0 en:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

International Electrotechnical Commission , 06/11/2003

Publisher: IEC

File Format: PDF

$46.00$92.00

Standard By:International Electrotechnical Commission , 06/11/2003

Published:06/11/2003

Pages:16

File Size:1 file , 500 KB

Language:English

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

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