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IEC 60191-6-6 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

International Electrotechnical Commission , 03/22/2001

Publisher: IEC

File Format: PDF

$37.00$74.00


Standard By:International Electrotechnical Commission , 03/22/2001
Published:03/22/2001
Pages:12
File Size:1 file , 120 KB
Language:English
Note:This product is unavailable in Ukraine, Russia, Belarus
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

IEC 60191-6-6 Ed. 1.0 en:2001 History

IEC 60191-6-6 Ed. 1.0 en:2001

IEC 60191-6-6 Ed. 1.0 en:2001

$37.00 $74.00

IEC 60191-6-6 Ed. 1.0 b:2001

IEC 60191-6-6 Ed. 1.0 b:2001

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