• IEC 60286-3 Ed. 4.0 en:2007

IEC 60286-3 Ed. 4.0 en:2007

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

International Electrotechnical Commission , 06/06/2007

Publisher: IEC

File Format: PDF

$64.00$128.00


It is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. It also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). It contains the following significant technical changes with respect to the previous edition: a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components); b) minor revisions related to tables, figures and references.

IEC 60286-3 Ed. 4.0 en:2007 History

IEC 60286-3 Ed. 7.0 b:2022

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IEC 60286-3 Ed. 6.0 b:2019

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IEC 60286-3 Ed. 5.0 b:2013

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IEC 60286-3 Ed. 4.0 en:2007
IEC 60286-3 Ed. 3.0 b:1997

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