IEC 60512-6-2 Ed. 1.0 b:2002

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump

International Electrotechnical Commission , 02/21/2002

Publisher: IEC

File Format: PDF

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Standard By:International Electrotechnical Commission , 02/21/2002

Published:02/21/2002

Pages:9

File Size:1 file , 400 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

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