IEC 60749-14 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

International Electrotechnical Commission , 08/07/2003

Publisher: IEC

File Format: PDF

$47.00$95.00


Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

More IEC Standards PDF

IEC 61558-2-17 Ed. 1.0 b:1997
IEC 60286-3 Ed. 3.0 b:1997
IEEE 1127-1998

IEEE 1127-1998

$59.00 $119.00

IEC 61300-3-22 Ed. 1.0 b:1997