IEC 60749-19 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

International Electrotechnical Commission , 02/13/2003

Publisher: IEC

File Format: PDF

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Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

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