IEC 60749-20 Ed. 1.0 b CORR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

International Electrotechnical Commission , 08/13/2003

Publisher: IEC

File Format: PDF

$84.00$168.70

Standard By:International Electrotechnical Commission , 08/13/2003

Published:08/13/2003

Pages:1

File Size:1 file , 60 KB

Language:English, French

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