IEC 60749-20 Ed. 3.0 b:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

International Electrotechnical Commission , 08/01/2020

Publisher: IEC

File Format: PDF

$117.00$234.00


This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

IEC 60749-20 Ed. 3.0 b:2020 History

IEC 60749-20 Ed. 3.0 b:2020

IEC 60749-20 Ed. 3.0 b:2020

$117.00 $234.00

IEC 60749-20 Ed. 2.0 b:2008
IEC 60749-20 Ed. 1.0 b CORR1:2003

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