IEC 60749-3 Ed. 2.0 en:2017

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

International Electrotechnical Commission , 03/03/2017

Publisher: IEC

File Format: PDF

$25.00$51.00


IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

IEC 60749-3 Ed. 2.0 en:2017 History

IEC 60749-3 Ed. 2.0 b:2017
IEC 60749-3 Ed. 2.0 en:2017
IEC 60749-3 Ed. 1.0 b CORR1:2003

More IEC Standards PDF

IEC 60603-7-41 Ed. 1.0 b:2010
IEC 61158-5-14 Ed. 2.0 en:2010
ICC NY-ECC-2010

ICC NY-ECC-2010

$18.00 $37.00

IEC 61158-5-2 Ed. 2.0 en:2010