IEC 60749-30 Ed. 1.0 b:2005

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

International Electrotechnical Commission , 01/20/2005

Publisher: IEC

File Format: PDF

$41.00$82.00


Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

IEC 60749-30 Ed. 1.0 b:2005 History

IEC 60749-30 Ed. 2.0 b:2020
IEC 60749-30 Ed. 1.1 b:2011
IEC 60749-30 Amd.1 Ed. 1.0 b:2011
IEC 60749-30 Ed. 1.0 b:2005

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