• IEC 60749-30 Ed. 1.1 b:2011

IEC 60749-30 Ed. 1.1 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION

International Electrotechnical Commission , 08/10/2011

Publisher: IEC

File Format: PDF

$70.00$141.00


IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.

IEC 60749-30 Ed. 1.1 b:2011 History

IEC 60749-30 Ed. 2.0 b:2020
IEC 60749-30 Ed. 1.1 b:2011
IEC 60749-30 Amd.1 Ed. 1.0 b:2011
IEC 60749-30 Ed. 1.0 b:2005

More IEC Standards PDF

IEC 60770-2 Ed. 3.0 b:2010
IEC 62481-3 Ed. 1.0 en:2010

IEC 62481-3 Ed. 1.0 en:2010

$140.00 $281.00

IEC 60684-3-280 Ed. 1.0 b:2010
IEC 60601-2-8 Ed. 2.0 b:2010