IEC 60749-9 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

International Electrotechnical Commission , 04/12/2002

Publisher: IEC

File Format: PDF

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Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.

IEC 60749-9 Ed. 1.0 b:2002 History

IEC 60749-9 Ed. 2.0 b:2017
IEC 60749-9 Ed. 2.0 en:2017
IEC 60749-9 Ed. 1.0 b CORR1:2003
IEC 60749-9 Ed. 1.0 b:2002

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