IEC 61188-6-3 Ed. 1.0 b:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

International Electrotechnical Commission , 12/01/2024

Publisher: IEC

File Format: PDF

$151.00$303.00

Description

Standard By:International Electrotechnical Commission , 12/01/2024

Published:12/01/2024

Pages:66

ISBN(s):9782832700693

File Size:1 file , 3.6 MB

Language:English, French

Note:This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

This part of IEC 61188 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

IEC 61188-6-3 Ed. 1.0 b:2024

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

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