IEC 61189-1 Ed. 1.1 b:2001

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology CONSOLIDATED EDITION

International Electrotechnical Commission , 11/22/2001

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 11/22/2001

Published:11/22/2001

Pages:51

File Size:1 file , 620 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.