IEC 61189-3 Amd.1 Ed. 1.0 b:2006

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

International Electrotechnical Commission , 08/11/2006

Publisher: IEC

File Format: PDF

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Standard By:International Electrotechnical Commission , 08/11/2006

Published:08/11/2006

Pages:65

File Size:1 file , 620 KB

Language:English, French

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