IEC 61189-5-301 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

International Electrotechnical Commission , 03/17/2021

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 03/17/2021

Published:03/17/2021

Pages:64

File Size:1 file , 4.2 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).

This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.

This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 ?m or less).

IEC 61189-5-301 Ed. 1.0 b:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

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