IEC 61192-2 Ed. 1.0 b:2003

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

International Electrotechnical Commission , 03/14/2003

Publisher: IEC

File Format: PDF

$176.00$352.00


Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

More IEC Standards PDF

IEC 62541-5 Ed. 1.0 b:2011

IEC 62541-5 Ed. 1.0 b:2011

$187.00 $375.00

IEC 60884-2-7 Ed. 1.0 b:2011
IEEE 1036-2010

IEEE 1036-2010

$101.00 $203.00

IEC 62541-6 Ed. 1.0 b:2011

IEC 62541-6 Ed. 1.0 b:2011

$169.00 $339.00