IEC 61192-2 Ed. 1.0 b:2003

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

International Electrotechnical Commission , 03/14/2003

Publisher: IEC

File Format: PDF

$176.00$352.00

Description

Standard By:International Electrotechnical Commission , 03/14/2003

Published:03/14/2003

Pages:127

File Size:1 file , 5.8 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

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