IEC 61192-4 Ed. 1.0 b:2002

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

International Electrotechnical Commission , 11/29/2002

Publisher: IEC

File Format: PDF

$99.00$199.00

Description

Standard By:International Electrotechnical Commission , 11/29/2002

Published:11/29/2002

Pages:59

File Size:1 file , 3.5 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

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