IEC 61760-2 Ed. 3.0 b:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

International Electrotechnical Commission , 07/01/2021

Publisher: IEC

File Format: PDF

$47.00$95.00


This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)

The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

IEC 61760-2 Ed. 3.0 b:2021 History

IEC 61760-2 Ed. 3.0 b:2021
IEC 61760-2 Ed. 2.0 b:2007
IEC 61760-2 Ed. 2.0 en:2007
IEC 61760-2 Ed. 1.0 b:1998

More IEC Standards PDF

IEC 60335-2-74 Ed. 2.2 b:2009
IEC 60286-3-1 Ed. 1.0 en:2009
IEC 60335-2-73 Ed. 2.2 b:2009
IEC 60286-3-2 Ed. 1.0 en:2009