IEC 61760-3 Ed. 2.0 b:2021

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

International Electrotechnical Commission , 02/03/2021

Publisher: IEC

File Format: PDF

$117.00$234.00


IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

IEC 61760-3 Ed. 2.0 b:2021 History

IEC 61760-3 Ed. 2.0 b:2021

IEC 61760-3 Ed. 2.0 b:2021

$117.00 $234.00

IEC 61760-3 Ed. 1.0 b:2010

More IEC Standards PDF

IEC 60896-22 Ed. 1.0 b:2004

IEC 60896-22 Ed. 1.0 b:2004

$117.00 $234.00

IEEE 1526-2003

IEEE 1526-2003

$55.00 $110.00

IEC 62264-2 Ed. 1.0 b:2004

IEC 62264-2 Ed. 1.0 b:2004

$190.00 $380.00

IEC 61857-1 Ed. 2.0 b:2004