IEC 61760-4 Ed. 1.1 b:2018

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices CONSOLIDATED EDITION

International Electrotechnical Commission , 03/13/2018

Publisher: IEC

File Format: PDF

$186.00$373.00


IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering. This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.

IEC 61760-4 Ed. 1.1 b:2018 History

IEC 61760-4 Ed. 1.1 b:2018

IEC 61760-4 Ed. 1.1 b:2018

$186.00 $373.00

IEC 61760-4 Ed. 1.0 b:2015

IEC 61760-4 Ed. 1.0 b:2015

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