IEC 62047-43 Ed. 1.0 en:2024

Semiconductor devices – Micro-electromechanical devices – Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices

International Electrotechnical Commission , 03/01/2024

Publisher: IEC

File Format: PDF

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This part of IEC 62047 specifies the test method of electrical characteristics after cyclic bending
deformation for flexible electromechanical devices. These devices include passive micro
components and active micro components on the flexible film or embedded in the flexible film.
The desired in-plane dimensions of the device for the test method ranges typically from 1 mm
to 300 mm and the thickness ranges from 10 μm to 1 mm, but these are not limiting values. The
test method is so designed as to understand and further visualize the entire performance
deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N:
Performance – Severity of bending – Number of cycles) plot over the loading space of severity
of bending and number of repeated cycles. This document is essential to estimate safety margin
over the operation period under a certain level of cyclic bending deformation and indispensable
for reliable design of the product employing these devices.

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