• IEC 62137-1-1 Ed. 1.0 en:2007

IEC 62137-1-1 Ed. 1.0 en:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

International Electrotechnical Commission , 07/11/2007

Publisher: IEC

File Format: PDF

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The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

IEC 62137-1-1 Ed. 1.0 en:2007 History

IEC 62137-1-1 Ed. 1.0 b:2008
IEC 62137-1-1 Ed. 1.0 en:2007
IEC 62137-1-1 Ed. 1.0 b:2007

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