IEC 62374-1 Ed. 1.0 b:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

International Electrotechnical Commission , 09/29/2010

Publisher: IEC

File Format: PDF

$47.00$95.00

Description

Standard By:International Electrotechnical Commission , 09/29/2010

Published:09/29/2010

Pages:32

File Size:1 file , 490 KB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

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