IEC 62769-1 Ed. 3.0 b:2023

Field device integration (FDI) - Part 1: Overview

International Electrotechnical Commission , 04/01/2023

Publisher: IEC

File Format: PDF

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Description

Standard By:International Electrotechnical Commission , 04/01/2023

Published:04/01/2023

Pages:64

ISBN(s):9782832264416

File Size:1 file , 1.5 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62769 describes the concepts and overview of the Field Device Integration (FDI®1) specifications. The detailed motivation for the creation of this technology is also described (see 4.1). Reading this document is helpful to understand the other parts of this multipart standard.