IEC 62878-2-602 Ed. 1.0 b:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

International Electrotechnical Commission , 06/01/2021

Publisher: IEC

File Format: PDF

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Standard By:International Electrotechnical Commission , 06/01/2021

Published:06/01/2021

Pages:28

ISBN(s):9782832298947

File Size:1 file , 4.9 MB

Language:English, French

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

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