IEC 63055 Ed. 2.0 en:2023

Format for LSI-Package-Board Interoperable design

International Electrotechnical Commission , 10/01/2023

Publisher: IEC

File Format: PDF

$256.00$512.00


This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

IEC 63055 Ed. 2.0 en:2023 History

IEC 63055 Ed. 2.0 en:2023

IEC 63055 Ed. 2.0 en:2023

$256.00 $512.00

IEC 63055 Ed. 1.0 en:2016

IEC 63055 Ed. 1.0 en:2016

$256.00 $512.00

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