IEC 63378-2-1 Ed. 1.0 en:2024

Thermal standardization on semiconductor packages – Part 2-1: 3D thermal simulation models of semiconductor packages for steadystate analysis – Discrete packages

International Electrotechnical Commission , 10/01/2024

Publisher: IEC

File Format: PDF

$51.00$103.00

Description

Standard By:International Electrotechnical Commission , 10/01/2024

Published:10/01/2024

Pages:20

ISBN(s):9782832298169

File Size:1 file , 1.1 MB

Language:English

Note:This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.

This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

More IEC Standards PDF

IEC 60974-2 Ed. 3.0 b:2013

$58.00 $117.00

IEC 61970-452 Ed. 1.0 b:2013

$193.00 $387.00

IEC 60974-7 Ed. 3.0 b:2013

$99.00 $199.00

IEC 60358-2 Ed. 1.0 b:2013

$72.00 $145.00