• IEC 63378-2-1 Ed. 1.0 en:2024

IEC 63378-2-1 Ed. 1.0 en:2024

Thermal standardization on semiconductor packages – Part 2-1: 3D thermal simulation models of semiconductor packages for steadystate analysis – Discrete packages

International Electrotechnical Commission , 10/01/2024

Publisher: IEC

File Format: PDF

$51.00$103.00


This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.

This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

More IEC Standards PDF

IEC 60958-1 Ed. 4.0 b:2021

IEC 60958-1 Ed. 4.0 b:2021

$117.00 $234.00

IEC 60747-8 Amd. 1 Ed. 3.0 e:2021
IEEE 2675-2021

IEEE 2675-2021

$52.00 $104.00

IEC 60747-5-13 Ed. 1.0 en:2021