IPC 4555:2022

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

Association Connecting Electronics Industries , 04/01/2022

Publisher: IPC

File Format: PDF

$59.00$119.00

Description

Standard By:Association Connecting Electronics Industries , 04/01/2022

Published:04/01/2022

Pages:24

ISBN(s):9781638160748

File Size:1 file , 990 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

IPC 4555 PDF

This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).

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