IPC 7095D-WAM1

Design and Assembly Process Implementation for BGAs, Includes Amendment 1

Association Connecting Electronics Industries , 06/01/2019

Publisher: IPC

File Format: PDF

$91.00$182.00

Description

Standard By:Association Connecting Electronics Industries , 06/01/2019

Published:06/01/2019

Pages:208

File Size:1 file , 13 MB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.