IPC 9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

Association Connecting Electronics Industries , 02/01/2022

Publisher: IPC

File Format: PDF

$51.00$102.00


This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

IPC 9701B History

IPC 9701B

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$51.00 $102.00

IPC 9701A

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