IPC 9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

Association Connecting Electronics Industries , 02/01/2022

Publisher: IPC

File Format: PDF

$51.00$102.00

Description

Standard By:Association Connecting Electronics Industries , 02/01/2022

Published:02/01/2022

Pages:24

ISBN(s):9781638160724

File Size:1 file , 1 MB

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.