IPC CHIPSCALE-99

Chip Scale and BGA National Symposium Proceedings 1999

Association Connecting Electronics Industries , 05/01/1999

Publisher: IPC

File Format: PDF

$63.00$126.00

Description

Standard By:Association Connecting Electronics Industries , 05/01/1999

Published:05/01/1999

Language:English

Note:This product is unavailable in Russia, Ukraine, Belarus

Proceedings are from the symposium held May 6-7, 1999 in Santa Clara, CA. The success of high density component packages is dependent on a "meeting of the minds" of the semiconductor manufacturer, the packaging technologist, the printed board fabricator, the assembly engineer and others. This event presented new substrate technology, wafer level processes, PCB design strategies, assembly and reliability data. OEMs and manufacturers and suppliers to the CSP/BGA assembly industry attended this two day event.

IPC CHIPSCALE-99

Chip Scale and BGA National Symposium Proceedings 1999

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