• IPC J-STD-005

IPC J-STD-005

Requirements for Soldering Pastes, Includes Amendment 1 (2007)

Association Connecting Electronics Industries , 01/01/1995

Publisher: IPC

File Format: PDF

$31.00$62.00


Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process). Supersedes QQ-S-571.

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