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Association Connecting Electronics Industries , 03/01/2024
Publisher: IPC
File Format: PDF
$51.00$103.00
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of requirements information and options that should be addressed when procuring solder paste.
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