• IPC TP-1115

IPC TP-1115

Selection and Implementation Strategy for a Low-Residue, No-Clean Process

Association Connecting Electronics Industries , 12/01/1998

Publisher: IPC

File Format: PDF

$80.00$160.00


This document provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concerns of process engineers and others coming into the field of low-residue processes from two different areas: those who currently clean finished electronic assemblies using water-based semi-aqueous or other environmentally acceptable solvents and defluxing technologies; or those who use a standard residue level (SR) no-clean assembly process. Both types of manufacturers should understand the advantages and pitfalls of using low-residue soldering materials. This guide allows electronics manufacturers to choose the process/materials that will best suit their needs.

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